An asymmetric Si/Si1-xGex channel vertical p-type metal-oxide-semiconductor field-effect transistor

被引:0
作者
Chen, XD [1 ]
Ouyang, Q [1 ]
Jayanarayanan, SK [1 ]
Prins, FE [1 ]
Banerjee, S [1 ]
机构
[1] Univ Texas, Microelect Res Ctr, Austin, TX 78758 USA
关键词
MOSFET; short channel effects; Si1-xGex; hole mobility;
D O I
10.1016/S0038-1101(01)00013-2
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this study, we discuss a vertical p-type metal-oxide-semiconductor held-effect transistor device structure with an asymmetric Si/Si1-xGex deep submicron (100 nm) channel. The source and source end of the channel are made of Si while rest of the channel and the drain are made of strained Si1-xGex. Compared with conventional Si device, the drive current of this asymmetric channel device is improved due to high electric field near the source end, high pinchoff voltage and high hole mobility in the strained Si1-xGex layer. The short channel effects and punchthrough are not degraded because the source and channel junction is made of Si, instead of strained Si1-xGex which has a smaller band gap. (C) 2001 Elsevier Science Ltd. All rights reserved.
引用
收藏
页码:281 / 285
页数:5
相关论文
共 14 条
[1]   SiGe heterojunction vertical p-type metal-oxide-semiconductor field-effect transistors with Si cap [J].
Chen, XD ;
Ouyang, Q ;
Onsongo, DM ;
Jayanarayanan, SK ;
Tasch, A ;
Banerjee, S .
APPLIED PHYSICS LETTERS, 2000, 77 (11) :1656-1658
[2]  
CHENG B, 1999, S VLSI TECHN KYOT JA, P69
[3]   A deep submicron Si1-xGex/Si vertical PMOSFET fabricated by Ge ion implantation [J].
Liu, KC ;
Ray, SK ;
Oswal, SK ;
Banerjee, SK .
IEEE ELECTRON DEVICE LETTERS, 1998, 19 (01) :13-15
[4]   Elementary scattering theory of the Si MOSFET [J].
Lundstrom, M .
IEEE ELECTRON DEVICE LETTERS, 1997, 18 (07) :361-363
[5]   SILICON MOS TRANSCONDUCTANCE SCALING INTO THE OVERSHOOT REGIME [J].
PINTO, MR ;
SANGIORGI, E ;
BUDE, J .
IEEE ELECTRON DEVICE LETTERS, 1993, 14 (08) :375-378
[6]   Vertical MOS transistors with 70 nm channel length [J].
Risch, L ;
Krautschneider, WH ;
Hofmann, F ;
Schafer, H ;
Aeugle, T ;
Rosner, W .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1996, 43 (09) :1495-1498
[7]   HIGH TRANSCONDUCTANCE AND VELOCITY OVERSHOOT IN NMOS DEVICES AT THE 0.1-MU-M GATE-LENGTH LEVEL [J].
SAIHALASZ, GA ;
WORDEMAN, MR ;
KERN, DP ;
RISHTON, S ;
GANIN, E .
IEEE ELECTRON DEVICE LETTERS, 1988, 9 (09) :464-466
[8]   An 0.1-μm asymmetric halo by large-angle-tilt implant (AHLATI) MOSFET for high performance and reliability [J].
Shin, H ;
Lee, S .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1999, 46 (04) :820-822
[9]  
Tasch AF, 1997, SECOND ANNUAL IEEE INTERNATIONAL CONFERENCE ON INNOVATIVE SYSTEMS IN SILICON, 1997 PROCEEDINGS, P52, DOI 10.1109/ICISS.1997.630246
[10]   CMOS scaling into the nanometer regime [J].
Taur, Y ;
Buchanan, DA ;
Chen, W ;
Frank, DJ ;
Ismail, KE ;
Lo, SH ;
SaiHalasz, GA ;
Viswanathan, RG ;
Wann, HJC ;
Wind, SJ ;
Wong, HS .
PROCEEDINGS OF THE IEEE, 1997, 85 (04) :486-504