Reliability Evaluation Methodology for Chip-Package Interaction Die Corner Edge Failure Mechanism

被引：5

作者：

Chin, Melida ^{[1
]}

Marathe, Amit ^{[1
]}

机构：

[1] GLOBALFOUNDRIES, Sunnyvale, CA 94085 USA

来源：

2010 INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM | 2010年

关键词：

CPI; crack driving force; crackstop; reliability;

D O I：

10.1109/IRPS.2010.5488789

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A novel reliability qualification methodology to evaluate chip-package interaction (CPI) is presented. Experimental and finite element analysis results are combined in a new protocol that provides solutions to address the need of CPI test vehicles for pre-qualification purposes, more accurate CPI risk projection, and more flexibility for productization.

引用

页码：453 / 457

页数：5