Cooling management of a protruding electronic components by using a phase change material heat sink

被引：4

作者：

Faraji, Mustapha ^{[1
]}

El Qarnia, Ramid ^{[1
]}

机构：

[1] Univ Cadi Ayyad, Fac Sci Semlalia, Dept Phys, Lab Mecan Fluides & Energet, Marrakech, Morocco

来源：

2007 14TH IEEE INTERNATIONAL CONFERENCE ON ELECTRONICS, CIRCUITS AND SYSTEMS, VOLS 1-4 | 2007年

关键词：

D O I：

10.1109/ICECS.2007.4510958

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The aim of the present work is to study the thermal performance of a hybrid heat sink used for cooling management of protruding substrate-mounted electronic chips. The power generated in electronic chips is dissipated in phase change material (PCM) that filled a rectangular enclosure. The advantage of using this cooling strategy is that the PCMs are able to absorb a high amount of heat generated by IC without operating the fan. A (2D) mathematical model was developed for a heat sink. Several experiment simulations were conducted to analyze the effect of the substrate thermal conductivity on the cooling of the chips.

引用

页码：174 / 177

页数：4

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