Development and mechanism of ultralow dielectric loss and toughened bismaleimide resins with high heat and moisture resistance based on unique amino-functionalized metal-organic frameworks

被引:41
作者
Han, Xianchao [1 ]
Yuan, Li [1 ]
Gu, Aijuan [1 ]
Liang, Guozheng [1 ]
机构
[1] Soochow Univ, State & Local Joint Engn Lab Novel Funct Polymer, Jiangsu Key Lab Adv Funct Polymer Design & Applic, Dept Mat Sci & Engn,Coll Chem Chem Engn & Mat Sci, Suzhou 215123, Peoples R China
基金
中国国家自然科学基金;
关键词
Thermosetting resin; Polymer-matrix composites (PMCs); Electrical properties; Mechanical properties; CYANATE ESTER; THIN-FILMS; PERFORMANCE; COMPOSITES; CONSTANT; CARBON; MIL-101; HYBRID; OXIDE;
D O I
10.1016/j.compositesb.2017.07.087
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
High dielectric loss is the main factor that leads to easy aging and low service reliability of electronic and insulation products. Herein, novel heat and moisture-resistant bismaleimide (BD) resins with ultralow dielectric loss and high toughness were developed through synthesizing unique amino-functionalized metal-organic framework (sN-MIL) with small pore diameter and low specific surface. The addition of only 0.3 wff sN-MIL into BD resin effectively improves impact strength and fracture toughness to about 1.70 times; meanwhile significantly reducing dielectric loss to only 0.0004 (100 Hz), which is almost the lowest dielectric loss reported among porous filler/polymer composites. The origin behind these attractive performances of sN-MIL/BD composites was intensively discussed. (C) 2017 Elsevier Ltd. All rights reserved.
引用
收藏
页码:28 / 34
页数:7
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