Corrosion characterization of tin-lead and lead free solders in 3.5 wt.% NaCl solution

被引：182

作者：

Li, Dezhi ^{[1
]}

Conway, Paul P. ^{[1
]}

Liu, Changqing ^{[1
]}

机构：

[1] Loughborough Univ Technol, Wolfson Sch Mech & Mfg Engn, Loughborough LE11 3TU, Leics, England

来源：

CORROSION SCIENCE | 2008年 / 50卷 / 04期

基金：

英国工程与自然科学研究理事会;

关键词：

eutectic Sn-Pb solder; lead free solders; potentiodynamic polarisation; passivation film;

D O I：

10.1016/j.corsci.2007.11.025

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The corrosion resistance of Sn-Pb and several candidate lead free solders were investigated in 3.5 wt.% NaCl solution through potentiodynamic polarisation. Results showed that in NaCl solution lead free solders had better corrosion resistance than Sn-Pb solder and the corrosion resistance of lead free solders was similar, but the corrosion resistance of Sn-Ag solder was better than that of Sn-Ag-Cu and Sn-Cu solders. The corrosion products for Sn-Pb solder had a two-layered structure with Sn-rich phases at the outer layer and looser Pb-rich phases at the inner layer. The loose Pb-rich layer was detrimental to the corrosion property. The corrosion product on the surface of all these solders was tin oxide chloride hydroxide. (c) 2007 Elsevier Ltd. All rights reserved.

引用

页码：995 / 1004

页数：10

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