Study on curing kinetics of diallyl-bearing epoxy resin using sulfur as curing agent

被引：40
作者：
Zhang, Guangpu [1 ]
Cheng, Jue [1 ,2 ]
Shi, Ling [1 ]
Lin, Xin [2 ]
Zhang, Junying [1 ,2 ]
机构：
[1] Beijing Univ Chem Technol, Key Lab Carbon Fiber & Funct Polymers, Minist Educ, Lab Adhes & Situ Polymerizat Technol, Beijing 100029, Peoples R China
[2] Beijing Univ Chem Technol, Changzhou Inst Adv Mat, Changzhou 213164, Peoples R China
来源：
THERMOCHIMICA ACTA | 2012年 / 538卷
基金：
中国国家自然科学基金; 国家高技术研究发展计划(863计划);
关键词：
DADGEBA; Sulfur; Curing kinetics; Mechanism equation; DIFFERENTIAL SCANNING CALORIMETRY; CURE KINETICS; FLAME-RETARDANT; DSC; SYSTEM; DEGRADATION; COMPOSITES; PHOSPHORUS;
D O I：
10.1016/j.tca.2012.03.012
中图分类号：
O414.1 [热力学];
学科分类号：
摘要：
In this paper the curing kinetics of diglycidyl ether of 4,4'-diallyl-bisphenol-A (DADGEBA) using sulfur (S) as curing agent was studied by non-isothermal and isothermal differential scanning calorimetry (DSC). The kinetic mechanism equations were determined using autocatalytic models and nth-order reaction model. DSC measurement showed that the curing process of DADGEBA/S system contains two steps because of the double exothermic peaks in DSC curve. The model data simulation results indicated that the Sestak-Berggren (SB) model had a great distinction with the experimental data. Isothermal DSC analysis showed that the curing reactions followed Kamal's autocatalytic model when the reaction temperature was below 210 degrees C, and when the temperature was above 210 degrees C the nth-order model can be used to describe the curing reaction process of the DADGEBA/S system perfectly. The two kinetic equations in the entire reaction process of DADGEBA/S system are consistent with the two-step reaction mechanisms of the same system. (c) 2012 Elsevier B.V. All rights reserved.
引用
收藏
页码：36 / 42
页数：7
相关论文
共 46 条
[1]   Curing kinetics study of epoxy resin/flexible amine toughness systems by dynamic and isothermal DSC [J].
Cai, Hongyang ;
Li, Peng ;
Sui, Gang ;
Yu, Yunhua ;
Li, Gang ;
Yang, Xiaoping ;
Ryu, Seungkon .
THERMOCHIMICA ACTA, 2008, 473 (1-2) :101-105
[2]  
Cantwell W.J., 1993, Chemistry and Technology of Epoxy
[3]  
Carfagna C, 2000, MACROMOL CHEM PHYSIC, V201, P2631, DOI 10.1002/1521-3935(20001201)201:18<2631::AID-MACP2631>3.3.CO
[4]  
2-#
[5]   Kinetic study of a phenolic-novolac resin curing process by rheological and DSC analysis [J].
Dominguez, J. C. ;
Alonso, M. V. ;
Oliet, M. ;
Rojo, E. ;
Rodriguez, F. .
THERMOCHIMICA ACTA, 2010, 498 (1-2) :39-44
[6]  
estk J., 1971, Thermochim. Acta, V3, P1, DOI [10.1016/0040-6031(71)85051-7, DOI 10.1016/0040-6031(71)85051-7, 10. 1016/0040-6031(71)85051-7]
[7]   Hybridization of epoxy resin with a layered titanate and UV light durability and controlled refractive index of the resulting nanocomposite [J].
Fuse, Yasufumi ;
Ide, Yusuke ;
Ogawa, Makoto .
POLYMER CHEMISTRY, 2010, 1 (06) :849-853
[8]   Synthesis of novel epoxy-group modified phosphazene-containing nanotube and its reinforcing effect in epoxy resin [J].
Gu, Xiaojun ;
Huang, Xiaobin ;
Wei, Hao ;
Tang, Xiaozhen .
EUROPEAN POLYMER JOURNAL, 2011, 47 (05) :903-910
[9]   Influence of fillers and additives on the cure kinetics of an epoxy/anhydride resin [J].
Harsch, Margit ;
Karger-Kocsis, Jozsef ;
Holst, Marco .
EUROPEAN POLYMER JOURNAL, 2007, 43 (04) :1168-1178
[10]   Cure kinetics and inter-domain etherification in an amine-cured phenoxy/epoxy system [J].
Hseih, HK ;
Su, CC ;
Woo, EM .
POLYMER, 1998, 39 (11) :2175-2183
12345