A study on the energy distribution for grid-assisting magnetron sputtering

被引：4
作者：
Jung, MJ
Chung, YM
Houska, J
Baroch, P
Vlcek, J
Musil, J
Nam, KH
Han, JG
机构：
[1] Sungkyunkwan Univ, Ctr Adv Plasma Surface Technol, Suwon 440746, South Korea
[2] Univ W Bohemia, Dept Phys, Plzen 30614, Czech Republic
来源：
SURFACE & COATINGS TECHNOLOGY | 2005年 / 200卷 / 1-4期
关键词：
magnetron sputtering; grid; titanium; ion bombardment; roughness;
D O I：
10.1016/j.surfcoat.2005.03.005
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
The Ti film deposited by grid-attached magnetron sputtering possesses rnirror-like surface RMS roughness of 0.6 similar to 1.3 tim. On the other hand, Ti film deposited by conventional magnetron sputtering possesses a steeply increased RMS surface roughness of 6 nm. The cross-sectional TEM micrographs indicated that Ti coating by conventional process was composed of large columnar structures. But Ti coating using two grid-attached magnetron type had a fine structures. By introducing a grid, the energy spectra of ions were characterized by a more extended high energy tail as compared to conventional magnetron sputtering. Therefore, more energetic ion bombardment generally enhances the depositing atom mobility in the case of the grid system as compared to the conventional system. (c) 2005 Elsevier B.V All rights reserved.
引用
收藏
页码：421 / 424
页数：4
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