共 18 条
- [1] CUMPSON PJ, 1995, RELAT PHENOM, V73, P25
- [4] Ta-rich atomic layer deposition TaN adhesion layer for Cu interconnects by means of plasma-enhanced atomic layer deposition [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2005, 23 (03): : 979 - 983
- [9] Effect of interfacial interactions on the initial growth of Cu on clean SiO2 and 3-mercaptopropyltrimethoxysilane-modified SiO2 substrates [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 2002, 20 (03): : 589 - 596