Single crystal silicon as a micromechanical material

被引：0

作者：

Kahn, H ^{[1
]}

Troyer, MJ ^{[1
]}

Prabhu, VR ^{[1
]}

Shih, CL ^{[1
]}

Phillips, SR ^{[1
]}

Huff, MA ^{[1
]}

Heuer, AH ^{[1
]}

机构：

[1] Case Western Reserve Univ, Dept Mat Sci & Engn, Cleveland, OH 44106 USA

来源：

INTEGRATED THIN FILMS AND APPLICATIONS | 1998年 / 86卷

关键词：

D O I：

暂无

中图分类号：

TQ174 [陶瓷工业]; TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Single crystal silicon is the standard substrate for both bulk- and surface-micromachined microelectromechanical systems (MEMS). However, it can also be used as a structural material itself in microdevices. In particular, single crystal silicon micro-springs have been designed and fabricated. These springs, which are approximately 20 mu m thick and 7 mm across, incorporate a central island that can be used to apply force to an external device, such as a microvalve or micropump. Varying designs can exhibit deflections of 50 to 1500 mu m under applied loads of 5 to 50 mN. The spring behavior has been fully characterized by mechanical testing and by finite element analysis. The micromachining techniques used to fabricate these devices create distinct surfaces of varying morphology, depending on the etching methods used. The fracture behavior of these diverse silicon surfaces is examined to ensure and improve the reliability of the devices.

引用

页码：119 / 124

页数：6