On the determination of energy fluxes at plasma-surface processes

A summary is given of different methods for the determination of the energy influx and its influence on the thermal balance and energetic conditions of substrate surfaces during plasma processing. The discussed mechanisms include heat radiation and kinetic and potential energy of charged particles and sputtered neutrals. For a few examples such as magnetron sputtering of a-C:H films, sputter deposition of aluminum on microparticles, and titanium deposition in a hollow-cathode are evaporation device the energetic balance of substrates during plasma processing is presented.