The texture and property of diffusion barrier of TiN thin films

被引:1
|
作者
Sung, DY [1 ]
Kim, I
Lee, MG
Yang, BY
Yang, JM
Ko, JK
机构
[1] Kumoh Natl Inst Technol, Sch Adv Mat & Syst Engn, Kumi 730701, Kyung Buk, South Korea
[2] Hynix Semicond Inc, Memory Res & Dev Div, Ichon 467701, Kyoungki Do, South Korea
来源
PRICM 5: THE FIFTH PACIFIC RIM INTERNATIONAL CONFERENCE ON ADVANCED MATERIALS AND PROCESSING, PTS 1-5 | 2005年 / 475-479卷
关键词
TiN; thin films; PVD; MOCVD; semiconductor; oxidized Si (SiO2/Si) wafer; diffusion barrier; copper metallization; texture; microstructure; SIMS; atomic concentration;
D O I
10.4028/www.scientific.net/MSF.475-479.1865
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The uniform and dense structure of thin films is influenced by the texture of films. It was good to have uniform and dense structure and bad to have an open columnar structure in TiN thin films. Therefore, the property of diffusion barrier of the TiN films in semiconductor also is related to the texture and microstructure of TiN coated layers. In this study, the relationships between the textures and microstructures and the properties of TiN films on semiconductor were investigated under different processing methods (PVD and MOCVD). The property of diffusion barrier of RF sputtered (PVD) TiN is better than that of metal organic chemical vapor deposited (MOCVD) TiN thin films. Also the property of diffusion barrier of PVD (111) textured TiN is better than that of PVD (100) textured TiN thin films on oxidized Si wafer.
引用
收藏
页码:1865 / 1868
页数:4
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