Condition monitoring the thermal path degradation of IGBT module using the time constants of junction temperature cooling curves

被引：0

作者：

Yu, Yaoyi ^{[1
]}

Du, Xiong ^{[1
]}

Zhang, Jun ^{[1
]}

Sun, Pengju ^{[1
]}

Tai, Heng-Ming ^{[2
]}

机构：

[1] State Key Lab Power Transmiss Equipment & Syst Se, Chongqing, Peoples R China

[2] Univ Tulsa, Dept Elect & Comp Engn, Tulsa, OK 74104 USA

来源：

2018 IEEE ENERGY CONVERSION CONGRESS AND EXPOSITION (ECCE) | 2018年

基金：

中国国家自然科学基金;

关键词：

IGBT; thermal; degradation; time constants; RELIABILITY;

D O I：

暂无

中图分类号：

TE [石油、天然气工业]; TK [能源与动力工程];

学科分类号：

0807 ; 0820 ;

摘要：

In this paper, we propose a new method to monitor the thermal path degradation of IGBT module using the time constants of the junction temperature cooling curve. The correlation between the time constants and Cauer-type thermal parameters is investigated. Results show that the thermal path degradation of IGBT module can be monitored by detecting the variation of time constants. Simulation and experimental tests are performed to verify the effectiveness of the proposed method.

引用

页码：358 / 361

页数：4

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