Ball bond characterization: An intensive analysis on ball size and shear test results and applicability to existing standards

被引：7

作者：

Aguila, MT ^{[1
]}

Felipe, RC ^{[1
]}

Velarde, AF ^{[1
]}

Edpan, JB ^{[1
]}

机构：

[1] Allegro Microsyst Phils Inc, Paranaque 1700, Philippines

来源：

PROCEEDINGS OF THE 1997 1ST ELECTRONIC PACKAGING TECHNOLOGY CONFERENCE | 1997年

关键词：

D O I：

10.1109/EPTC.1997.723884

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

To date, the American Society for Testing and Materials (ASTM) is the criteria widely used at the semiconductor industry wherein the minimum ball shear test requirement is based on the wire diameter. Lately, another standard was introduced in the business, the Automotive Electronic Council (AEC) standard which prescribed a minimum shear reading for a corresponding ball diameter produced. In line with this, this paper presents the characterization made on attributes which could affect the ball formation and shear test results. Moreover, a study was conducted to determine the running capability on ball diameter size and ball shear test readings with respect to ASTM and AEC standards.

引用

页码：46 / 51

页数：6