Interaction of Cu atoms with ordered 2D oligopyridine networks

被引:21
作者
Breitruck, A.
Hoster, H. E. [1 ]
Meier, C.
Ziener, U.
Behm, R. J.
机构
[1] Univ Ulm, Inst Catalysis & Surface Chem, D-89069 Ulm, Germany
[2] Univ Ulm, Dept Organ Chem Macromol Chem 3, D-89069 Ulm, Germany
关键词
scanning tunneling microscopy; metal-ligand interactions; metal-organic network; self assembly; HOPG; oligopyridine;
D O I
10.1016/j.susc.2007.04.173
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
The effect of Cu deposition on pre-deposited ordered oligopyridine networks on HOPG was investigated by scanning tunneling microscopy (STM) under ultrahigh vacuum (UHV) conditions. Deposition of small amounts of Cu and subsequent annealing results in the formation of a new hexagonal metal organic structure, coexisting with the previous quasiquadratic network (QQN) phase. In the new phase, the oligopyridines are dominantly linked by incorporated Cu centers. The high stability of the bonds between pyridyl nitrogen atoms and Cu-2 dimers, which is the structure determining element in the metal organic network, overcompensates the loss in C-H center dot center dot center dot N bridge interaction, which is the dominant interaction in the QQN phase. The Cu-2 mediated gain in intermolecular interaction energy provides the driving force for the Cu induced structural transition, from QQN phase to the hexagonal metal organic network structure. (C) 2007 Elsevier B.V. All rights reserved.
引用
收藏
页码:4200 / 4205
页数:6
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