Effect of TiO2 additions on Sn-0.7Cu-0.05Ni lead-free composite solder

被引：49
作者：
Ramli, M. I. I. [1 ]
Saud, N. [1 ]
Salleh, M. A. A. Mohd [1 ]
Derman, M. N. [1 ]
Said, R. Mohd [1 ]
机构：
[1] Univ Malaysia Perlis, Ctr Excellence Geopolymer & Green Technol CeGeoGT, Sch Mat Engn, Arau 02600, Perlis, Malaysia
来源：
MICROELECTRONICS RELIABILITY | 2016年 / 65卷
关键词：
Soldering alloy; Intermetallic; Alloys; Powder metallurgy; Fracture; INTERMETALLIC COMPOUND; MECHANICAL-PROPERTIES; NI; MICROSTRUCTURE; TEMPERATURE; GROWTH; TRANSFORMATIONS; SUPPRESSION; CU6SN5; JOINT;
D O I：
10.1016/j.microrel.2016.08.011
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The effect of TiO2 addition on the microstructure, melting behavior, microhardness and interfacial reaction between Sn-0.7Cu-0.05Ni and a Cu-substrate were explored. Samples with various TiO2 percentages (0, 0.25, 0.5, 0.75 and 1.0 wt.%) were prepared using a microwave-assisted sintering powder metallurgy method. Microstructural analysis reveals that TiO2 was uniformly distributed along the grain boundary of the bulk solder. Differential scanning calorimetry (DSC) results showed a decrease in the undercooling while melting temperature of the solder slightly increase. The thickness of the interfacial intermetallic compounds of the solder joint was reduced with the addition of TiO2 particles. This thickness reduction indicates that the presence of a small amount of TiO2 particles is effective in suppressing the growth of the intermetallic compound layer. Small dimples on the fracture surface have revealed that the Sn-Cu-Ni composite solder exhibits typical ductile failure. Overall, the addition of TiO2 to Sn-0.7Cu-0.05Ni solder dramatically increases its shear strength and hardness and improves its wetting properties and fracture surface. (C) 2016 Elsevier Ltd. All rights reserved.
引用
收藏
页码：255 / 264
页数：10
相关论文
共 47 条
[1]   Effect of micron size Ni particle addition in Sn-8Zn-3Bi lead-free solder alloy on the microstructure, thermal and mechanical properties [J].
Billah, Md Muktadir ;
Shorowordi, Kazi Mohammad ;
Sharif, Ahmed .
JOURNAL OF ALLOYS AND COMPOUNDS, 2014, 585 :32-39
[2]  
Chang C. C. J. S. Y., 2011, MATER DESIGN, V32, P4720, DOI DOI 10.1016/j.matdes.2011.06.044
[3]   Effects of Ti addition to Sn-Ag and Sn-Cu solders [J].
Chen, W. M. ;
Kang, S. K. ;
Kao, C. R. .
JOURNAL OF ALLOYS AND COMPOUNDS, 2012, 520 :244-249
[4]   Effects of small amount of active Ti element additions on microstructure and property of Sn3.5Ag0.5Cu solder [J].
Chuang, C. L. ;
Tsao, L. C. ;
Lin, H. K. ;
Feng, L. P. .
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2012, 558 :478-484
[5]   AgIn2/Ag2In transformations in an In-49Sn/Ag soldered joint under thermal aging [J].
Chuang, TH ;
Huang, YT ;
Tsao, LC .
JOURNAL OF ELECTRONIC MATERIALS, 2001, 30 (08) :945-950
[6]   Microstructural modifications and properties of SiC nanoparticles-reinforced Sn-3.0Ag-0.5Cu solder alloy [J].
El-Daly, A. A. ;
Desoky, W. M. ;
Elmosalami, T. A. ;
El-Shaarawy, M. G. ;
Abdraboh, A. M. .
MATERIALS & DESIGN, 2015, 65 :1196-1204
[7]   Structural characterization and creep resistance of nano-silicon carbide reinforced Sn-1.0Ag-0.5Cu lead-free solder alloy [J].
El-Daly, A. A. ;
Al-Ganainy, G. S. ;
Fawzy, A. ;
Younis, M. J. .
MATERIALS & DESIGN, 2014, 55 :837-845
[8]   Novel SiC nanoparticles-containing Sn-1.0Ag-0.5Cu solder with good drop impact performance [J].
El-Daly, A. A. ;
Fawzy, A. ;
Mansour, S. F. ;
Younis, M. J. .
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2013, 578 :62-71
[9]  
Gain A. K., 2016, J MATER SCI-MATER EL, V27, P1
[10]   Growth mechanism of intermetallic compound and mechanical properties of nickel (Ni) nanoparticle doped low melting temperature tin-bismuth (Sn-Bi) solder [J].
Gain, Asit Kumar ;
Zhang, Liangchi .
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2016, 27 (01) :781-794
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