Experimental study of diffusion welding/bonding of titanium to copper

被引:120
作者
Aydin, Kemal [1 ]
Kaya, Yakup [1 ]
Kahraman, Nizamettin [1 ]
机构
[1] Karabuk Univ, Fac Technol, TR-78050 Karabuk, Turkey
关键词
D. Diffusion bonding; E. Mechanical properties; G. Scanning electron microscopy; COMMERCIALLY PURE TITANIUM; BONDING PROCESS PARAMETERS; ALLOY; MICROSTRUCTURE; TI-6AL-4V; STRENGTH; JOINTS; SILVER;
D O I
10.1016/j.matdes.2012.01.026
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In the present study, Ti-6Al-4V alloy was bonded to electrolytic copper at various temperatures of 875, 890 and 900 degrees C and times of 15, 30 and 60 min through diffusion bonding. 3 MPa uniaxial load was applied during the diffusion bonding. Interface quality of the joints was assessed by microhardness and shear testing. Also, the bonding interfaces were analysed by means of optical microscopy, scanning electron microscopy and energy dispersive spectrometer. The bonding of Ti-6Al-4V to Cu was successfully achieved by diffusion bonding method. The maximum shear strength was found to be 2171 N for the specimen bonded at 890 degrees C for 60 min. The maximum hardness values were obtained from the area next to the interface in titanium side of the joint. The hardness values were found to decrease with increasing distance from the interface in titanium side while it remained constant in copper side. It was seen that the diffusion transition zone near the interface consists of various phases of beta Cu4Ti, Cu2Ti, Cu3Ti2, Cu4Ti3 and CuTi. (C) 2012 Elsevier Ltd. All rights reserved.
引用
收藏
页码:356 / 368
页数:13
相关论文
共 34 条
[1]   Weldability of Al4C3-Al composites via diffusion welding technique [J].
Arik, H ;
Aydin, M ;
Kurt, A ;
Turker, M .
MATERIALS & DESIGN, 2005, 26 (06) :555-560
[2]  
Askeland R. D., 1994, SCI ENG MAT
[3]   Diffusion bonding of commercially pure titanium to low carbon steel using a silver interlayer [J].
Atasoy, Euren ;
Kahraman, Nizamettin .
MATERIALS CHARACTERIZATION, 2008, 59 (10) :1481-1490
[4]   The diffusion welding of 7075Al-3%SiC particles reinforced composites [J].
Aydin, M. ;
Gurler, R. ;
Turker, M. .
PHYSICS OF METALS AND METALLOGRAPHY, 2009, 107 (02) :206-210
[5]  
Bateni M. Reza, 2003, NAT TRIB C CRAIOV RO, P55
[6]  
Callister W.D., 2001, FUNDAMENTALS MAT SCI, V5th, DOI 10.1007/978-981-10-2529-7_2
[8]   Molecular dynamics modeling of diffusion bonding [J].
Chen, SD ;
Soh, AK ;
Ke, FJ .
SCRIPTA MATERIALIA, 2005, 52 (11) :1135-1140
[9]   Solid-State Welding of Tubular Joints of Titanium and Copper with Application of Electrohydropulse Loading [J].
Demidenko, L. Yu. ;
Onatskaya, N. A. .
SURFACE ENGINEERING AND APPLIED ELECTROCHEMISTRY, 2008, 44 (03) :245-247
[10]   Solid state diffusion bonding of titanium to steel using a copper base alloy as interlayer [J].
Elrefaey, A. ;
Tillmann, W. .
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 2009, 209 (05) :2746-2752