共 5 条
Strain Effect in Highly-Doped n-Type 3C-SiC-on-Glass Substrate for Mechanical Sensors and Mobility Enhancement
被引:7
|作者:
Hoang-Phuong Phan
[1
,2
]
Tuan-Khoa Nguyen
[1
]
Toan Dinh
[1
]
Cheng, Han-Hao
[3
]
Mu, Fengwen
[4
]
Iacopi, Alan
[1
]
Hold, Leonie
[1
]
Dzung Viet Dao
[1
,5
]
Suga, Tadatomo
[4
]
Senesky, Debbie G.
[2
,6
]
Nam-Trung Nguyen
[1
]
机构:
[1] Griffith Univ, Queensland Micro & Nanotechnol Ctr, West Creek Rd, Nathan, Qld 4111, Australia
[2] Stanford Univ, Dept Aeronaut & Astronaut, Stanford, CA 94305 USA
[3] Univ Queensland, Ctr Microscopy Microanal, Brisbane, Qld 4072, Australia
[4] Univ Tokyo, Dept Precis Engn, Tokyo 1138654, Japan
[5] Griffith Univ, Sch Engn, Gold Coast, Qld 4215, Australia
[6] Stanford Univ, Dept Elect Engn, Stanford, CA 94305 USA
来源:
PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE
|
2018年
/
215卷
/
24期
基金:
澳大利亚研究理事会;
关键词:
MEMS;
piezoresistance;
silicon carbide;
strain engineering;
wafer bonding;
SILICON-CARBIDE FILMS;
PIEZORESISTANCE;
ELECTRONICS;
PLATFORM;
ORIENTATION;
FABRICATION;
TRANSISTORS;
GRAPHENE;
GROWTH;
D O I:
10.1002/pssa.201800288
中图分类号:
T [工业技术];
学科分类号:
08 ;
摘要:
This work reports the strain effect on the electrical properties of highly doped n-type single crystalline cubic silicon carbide (3C-SiC) transferred onto a 6-inch glass substrate employing an anodic bonding technique. The experimental data shows high gauge factors of -8.6 in longitudinal direction and 10.5 in transverse direction along the [100] orientation. The piezoresistive effect in the highly doped 3C-SiC film also exhibits an excellent linearity and consistent reproducibility after several bending cycles. The experimental result is in good agreement with the theoretical analysis based on the phenomenon of electron transfer between many valleys in the conduction band of n-type 3C-SiC. Our finding for the large gauge factor in n-type 3C-SiC coupled with the elimination of the current leak to the insulated substrate could pave the way for the development of single crystal SiC-on-glass based MEMS applications.
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页数:6
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