Forming mechanism and mechanical property of pulsed laser welded Ti alloy and stainless steel joint using copper as interlayer

被引:23
作者
Zhang, Yan [1 ]
Chen, YanKun [1 ]
Zhou, JianPing [1 ]
Sun, DaQian [2 ]
Gu, XiaoYan [2 ]
机构
[1] Xinjiang Univ, Sch Mech Engn, Urumqi 830000, Peoples R China
[2] Jilin Univ, Sch Mat Sci & Engn, Key Lab Automobile Mat, Changchun 130022, Peoples R China
来源
JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T | 2020年 / 9卷 / 02期
关键词
Cu interlayer; Laser offset; Microstructure; ELECTRON-BEAM; TITANIUM-ALLOY; MICROSTRUCTURES; 304-STAINLESS-STEEL; INTERMETALLICS;
D O I
10.1016/j.jmrt.2019.11.068
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In this work, Cu was used as an interlayer to prevent the formation of these brittle Ti-Fe intermetallics when joining Ti alloy to stainless steel (SS). Microstructures of the joint were analyzed by optical microscopy, scanning electron microscopy, transmission electron microscope and X-ray diffraction. The tensile strengths of the joint were also measured. The laser was focused on the SS side of the joint, which joined the SS and Cu by fusion welding. At SS-Cu interface, a weld zone was formed due to dilution of the Cu and mixing with the SS. At the Ti alloy-Cu interface, a eutectic reaction was responsible for joining. The presence of unmelted Cu interlayer ensured that crack free welds were obtained and no brittle Ti-Fe intermetallics were observed. Tensile strength of the joint can reach to 320 MPa. (C) 2019 The Authors. Published by Elsevier B.V.
引用
收藏
页码:1425 / 1433
页数:9
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