Three-Dimensional Printing of Interconnects by Laser Direct-Write of Silver Nanopastes

被引：142

作者：

Wang, Jiwen ^{[1
]}

Auyeung, Raymond C. Y. ^{[1
]}

Kim, Heungsoo ^{[1
]}

Charipar, Nicholas A. ^{[1
]}

Pique, Alberto ^{[1
]}

机构：

[1] USN, Res Lab, Washington, DC 20375 USA

来源：

ADVANCED MATERIALS | 2010年 / 22卷 / 40期

关键词：

ALUMINA SUSPENSIONS; PERIODIC STRUCTURES; FABRICATION; ELECTRODES; RHEOLOGY; FILM;

D O I：

10.1002/adma.201001729

中图分类号：

O6 [化学];

学科分类号：

0703 ;

摘要：

A novel non-contact 3-dimensional laser direct-write process is demonstrated. Freestanding silver interconnects with various widths (8-75 μm), loop heights (1-10 μm), and bond lengths (8-100 μm) are printed on various substrates. We demonstrate the capability of this technology for ultrafine (<1 μm) pitch bonding and for connecting LEDs embedded in flexible polyimide substrates © 2010 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

引用

收藏

页码：4462 / 4466

页数：5

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