Ultrasonic-assisted soldering of fine-grained 7034 aluminum alloy using Sn-Zn solders below 300 °C

The fine-grained Al alloys prefer to be soldered at as low as temperature to keep their mechanical properties. Solders of Sn-4Zn, Sn-9Zn, and Sn-20Zn alloys were used to solder fine-grained 7034 Al alloy pieces by ultrasonic-assisted soldering below 300 degrees C in air. The joint using Sn-4Zn solder had the highest tensile strength of 201 MPa and the fractures occurred in both beta-Sn and Sn-Zn eutectic phases. Such joint was much stronger than the 1060 Al joint using Sn-4Zn solder, and its strength had approached the strength of 7034 Al joint using Zn-5A1 solder. The strength of the joints using Sn-9Zn and Sn-20Zn solders dropped to similar to 160 MPa due to the appearance of weak interfaces between eta-Zn and eutectic phases in the bond layers. All the joints using Sn-Zn solders had very strong interfacial bonding, and alumina interlayers were identified at all the interfaces. Al dissolved in the bond layer reacted with the O rapidly to form alumina interlayers at the interfaces under the ultrasonic action. Zn segregated at the interface and formed strong bonds with both the Al terminated surface of alumina and the bond layer, resulting in strong interfacial bonding between Sn-Zn solders and Al alloys.