Organic and printed process design kits: review, analysis and comparison

被引:3
|
作者
Arna, August [1 ,2 ]
Teres, Lluis [1 ]
Ramon, Eloi [1 ]
机构
[1] Inst Microelect Barcelona IMB CNM CSIC, Barcelona, Spain
[2] Univ Autonoma Barcelona UAB, Elect & Telecomunicac Engn, Barcelona, Spain
来源
FLEXIBLE AND PRINTED ELECTRONICS | 2021年 / 6卷 / 03期
关键词
organic electronics; printed electronics; organic thin-film transistor (OTFT); compact models; electric simulation; process design kit (PDK); THIN-FILM TRANSISTORS; FIELD-EFFECT TRANSISTORS; HIGH-PERFORMANCE; COMPLEMENTARY CIRCUITS; DIGITAL CIRCUITS; COMPACT MODEL; ELECTRONICS; LOGIC; TEMPERATURE; FABRICATION;
D O I
10.1088/2058-8585/ac1d39
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Organic and printed electronics (OE) is a promising technology for reducing the waste and the price of electronic systems for new devices. OE offers technological advantages not available in conventional silicon processes such as physical flexibility, large area fabrication, mask-less deposition, low process temperatures and fully additive manufacturing-processes that all enable low-cost and low-waste fabrication techniques. Despite these advantages, important difficulties remain for developing compact models for transistors due to intrinsic variability in the manufacturing process and the behaviour of organic materials, which make it difficult to match the model and the experimental data. Due to disparity in the fabrication methodologies and the different topologies of transistors used, the diversity in compact models is noticeable. These different models provide specific solutions for particular devices and require various process design kits (PDKs) for each manufacturing process. This review covers the different PDKs developed in the OE field and compares them with the electric models used for simulation purposes. Both simulated and fabricated systems are included with the aim of providing the reader with a clear state-of-the-art of the OE situation.
引用
收藏
页数:20
相关论文
共 50 条
  • [31] Performance Analysis and Design Comparison of Junctionless TFET: a Review Study
    Mohanty, Aradhana
    Ahmad, Md Akram
    Kumar, Pankaj
    Kumar, Raushan
    SILICON, 2024, 16 (18) : 6305 - 6312
  • [32] Business process design: Process comparison and integration
    Xiao, Lan
    Zheng, Li
    INFORMATION SYSTEMS FRONTIERS, 2012, 14 (02) : 363 - 374
  • [33] Business process design: Process comparison and integration
    Lan Xiao
    Li Zheng
    Information Systems Frontiers, 2012, 14 : 363 - 374
  • [34] Design of versatile printed organic resistor based on resistivity (ρ) control
    Shawkat Ali
    Jinho Bae
    Chong Hyun Lee
    Applied Physics A, 2015, 119 : 1499 - 1506
  • [35] Design of versatile printed organic resistor based on resistivity (ρ) control
    Ali, Shawkat
    Bae, Jinho
    Lee, Chong Hyun
    APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING, 2015, 119 (04): : 1499 - 1506
  • [36] Comparison of Commercial Kits for Recovery and Analysis of Bacterial DNA From Fingerprints
    Assenmacher, Daniel M.
    Fields, Stephen D.
    Crupper, Scott S.
    JOURNAL OF FORENSIC SCIENCES, 2020, 65 (04) : 1310 - 1314
  • [37] Challenges in Gluten Analysis: A Comparison of Four Commercial Sandwich ELISA Kits
    Amnuaycheewa, Plaimein
    Niemann, Lynn
    Goodman, Richard E.
    Baumert, Joseph L.
    Taylor, Steve L.
    FOODS, 2022, 11 (05)
  • [38] Process design and economic analysis of methacrylic acid extraction for three organic solvents
    Li, Jie
    Peng, Zhijian
    Li, Chunshan
    Li, Ping
    Gani, Rafiqul
    CHINESE JOURNAL OF CHEMICAL ENGINEERING, 2019, 27 (12) : 2909 - 2916
  • [39] Process design and economic analysis of methacrylic acid extraction for three organic solvents
    Jie Li
    Zhijian Peng
    Chunshan Li
    Ping Li
    Rafiqul Gani
    Chinese Journal of Chemical Engineering, 2019, 27 (12) : 2909 - 2916
  • [40] REVIEW ON MECHANICAL DESIGN OF PRINTED CIRCUIT HEAT EXCHANGERS
    Zhang, Xiaoqin
    Shi, Shanbin
    Christensen, Richard N.
    Sun, Xiaodong
    PROCEEDINGS OF THE 25TH INTERNATIONAL CONFERENCE ON NUCLEAR ENGINEERING, 2017, VOL 9, 2017,