Electrochemical fabrication of large arrays of metal nanoclusters

被引：80

作者：

Engelmann, GE ^{[1
]}

Ziegler, JC ^{[1
]}

Kolb, DM ^{[1
]}

机构：

[1] Univ Ulm, Dept Electrochem, D-89069 Ulm, Germany

来源：

SURFACE SCIENCE | 1998年 / 401卷 / 02期

关键词：

copper; nanostructures; scanning tunneling microscopy; solid-liquid interfaces; tunnel barrier;

D O I：

10.1016/S0039-6028(98)00078-8

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

Tip-induced metal deposition was employed to fabricate large, micrometer-size arrays of Cu nanoclusters on Au(111) electrodes. The fully-automated process allowed to produce clusters of uniform size at a rate of 50 Hz. An array of 10(4) Cu clusters placed on Au(111) at intervals of 11 nm was generated within 17 min. It is demonstrated that the cluster fabrication procedure allows us to surmount several monoatomically high steps in the substrate, indicating that this type of nanostructuring does not require perfectly flat surfaces. No sign of a depletion of the deposited metal has been noted even after production of 10(4) Cu clusters. The externally controlled tip approach employed for the cluster generation, was also used to determine the tunnel barrier in an electrochemical environment. With this method a tunnel barrier of 1.5+/-0.1 eV was found. (C) 1998 Elsevier Science B.V. All rights reserved.

引用

页码：L420 / L424

页数：5

共 23 条

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BALDAUF M, 1996, THESIS U ULM

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