Study of a dipping method for flip-chip flux coating

被引：2
|
作者：
Zhang Wei
Li Junhui
Han Lei [1 ]
机构：
[1] Cent S Univ, Sch Mech & Elect Engn, Changsha 410083, Hunan, Peoples R China
来源：
MICROELECTRONICS RELIABILITY | 2014年 / 54卷 / 11期
关键词：
Dipping flux; Gluing; Rheological; Reflective area ratio; Flow velocity;
D O I：
10.1016/j.microrel.2014.04.013
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A dipping method for flux coating is proposed in the paper. Flow process of the flux transferred into the groove is investigated by using an optical detection means. Flow process influenced by gluing speed and viscosity is analyzed by using two indicators including reflective area ratio and flow velocity. Experimental result shows that stably reflective area ratio of glue is associated with gluing speed instead of viscosity; and it decreases with the increase of gluing speed in a same viscosity. The reason is that different gluing speed changes the amount of the glue transferred to the groove. Flow velocity of glue is related with gluing speed, a greater gluing speed leads to greater maximum flow velocity at the same viscosity, which may be due to larger gluing speed gives greater inertial force to the glue. Real chip experiments verified the feasibility of this method. (C) 2014 Elsevier Ltd. All rights reserved.
引用
收藏
页码：2479 / 2486
页数：8
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