Soldered joints for shape memory components

被引:0
作者
Breidert, J [1 ]
Michutta, J [1 ]
Siegert, W [1 ]
Neuking, K [1 ]
Welp, EG [1 ]
机构
[1] Ruhr Univ Bochum, Inst Engn Design, D-44780 Bochum, Germany
来源
SMST-2003: Proceedings of the International Conference on Shape Memory and Superelastic Technologies | 2004年
关键词
soldering; joints; NiTi alloys; strength;
D O I
暂无
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The problem of coupling shape memory alloys (SMA) components with surrounding parts occurs in nearly all SMA applications. Difficulties in joint design for SMA applications exist both in the selection of the appropriate coupling type and in the lack of specifications for the various joints. Due to these problems, a systematic overview will be presented on aspects of joints for SMA components and results from tensile tests of soldered joints. The tested joints consisted of joints between NiTi sheets and short brass sockets and NiTi wires. In order to optimize the strength of the wire joints, the ratio of the wire and the tube diameters were experimentally varied.
引用
收藏
页码:209 / 217
页数:9
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