On-chip testing of mechanical properties of MEMS devices

被引：10

作者：

Kahn, H ^{[1
]}

Heuer, AH ^{[1
]}

Ballarini, R ^{[1
]}

机构：

[1] Case Western Reserve Univ, Dept Mat Sci & Engn, Cleveland, OH 44106 USA

来源：

MRS BULLETIN | 2001年 / 26卷 / 04期

关键词：

D O I：

10.1557/mrs2001.64

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

[No abstract available]

引用

页码：300 / 301

页数：2

共 9 条

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Kahn H, 2000, MATER RES SOC SYMP P, V605, P25

[8] TENSILE PROPERTIES OF ALUMINUM ALUMINA MULTILAYERED THIN-FILMS [J].

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