Simulation of SMT reflow soldering process and its optimum

被引：0
作者：
Yi, YQ [1 ]
Zhou, DJ [1 ]
机构：
[1] Guilin Univ Elect Technol, Guilin, Peoples R China
来源：
PROCEEDINGS OF THE 3RD CHINA-JAPAN SYMPOSIUM ON MECHATRONICS | 2002年
关键词：
reflow solder; reflow profile; simulation; optimum;
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Process simulation system of SMT reflow soldering based on the thermal analysis and SPC control principle is presented in this paper, targeting at the best setup of reflow profile before the actual assembly. The results generated from the simulation system shows that the system is practicable for reflow profile optimum of SMT reflow soldering.
引用
收藏
页码：302 / 305
页数：4
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