20-Gb/s/ch High-Speed Low-Power 1-Tb/s Multilayer Optical Printed Circuit Board With Lens-Integrated Optical Devices and CMOS IC

被引：18

作者：

Matsuoka, Y. ^{[1
]}

Kawamura, D. ^{[1
]}

Adachi, K. ^{[1
,2
]}

Lee, Y. ^{[1
,2
]}

Hamamura, S. ^{[3
]}

Takai, T. ^{[3
]}

Shibata, T. ^{[4
]}

Masuda, H. ^{[4
]}

Chujo, N. ^{[3
]}

Sugawara, T. ^{[1
]}

机构：

[1] Hitachi Ltd, Cent Res Lab, Tokyo 1858601, Japan

[2] PETRA, Tokyo 1120014, Japan

[3] Hitachi Ltd, Prod Engn Res Lab, Yokohama, Kanagawa 2448567, Japan

[4] Hitachi Chem Co Ltd, Tsukuba Res Lab, Ibaraki 3004247, Japan

来源：

IEEE PHOTONICS TECHNOLOGY LETTERS | 2011年 / 23卷 / 18期

关键词：

Lens-integrated optical device; optical printed circuit board (OPCB); 20-Gb/s/ch optical interconnect;

D O I：

10.1109/LPT.2011.2160939

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A high-speed large-capacity optical printed circuit board (OPCB) for next-generation high-capacity routers and servers was developed. This OPCB is composed of a multi-layer polymer optical waveguide, a receiver optical input/output (I/O) module (with a lens-integrated photodiode and a SiGe transimpedance amplifier), and a low-power (7.1 mW/Gb/s) transmitter optical I/O module consisting of a lens-integrated surface-emitting laser and complementary metal-oxide-semiconductor (CMOS) driver IC. A 1-Tb/s (20 Gb/s/ch x 48 ch per transmitter or receiver) large-capacity OPCB prototype was fabricated and demonstrated 20-Gb/s/ch operation.

引用

页码：1352 / 1354

页数：3

共 10 条

[1]

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[2]

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[3]

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[6]

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[7]

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Ishigure, Takaaki .

JOURNAL OF LIGHTWAVE TECHNOLOGY, 2009, 27 (14) :2852-2861

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