Pool Boiling Heat Transfer on a Micro-Structured Copper Oxide Surface with Varying Wettability

被引：11
作者：
Sen, Pulak [1 ]
Kalita, Sanjib [2 ]
Sen, Dipak [2 ]
Das, Sudev [3 ]
Das, Ajoy Kumar [1 ]
机构：
[1] Natl Inst Technol Agartala, Dept Mech Engn, Jirania 799046, Tripura, India
[2] Natl Inst Technol Arunachal Pradesh, Dept Mech Engn, Jote 791113, Arunachal Prade, India
[3] Natl Inst Technol Calicut, Dept Chem Engn, Kozhikode 673601, Kerala, India
来源：
CHEMICAL ENGINEERING & TECHNOLOGY | 2022年 / 45卷 / 05期
关键词：
Boiling heat transfer coefficient; Bubble dynamics; Chemical etching; Critical heat flux; Microstructured copper oxide surface; CARBON NANOTUBE COATINGS; TRANSFER ENHANCEMENT; SUPERHYDROPHILIC SURFACE; TEXTURED SURFACES; FLUX; WATER; NANOFLUIDS; PERFORMANCE; DEPOSITION; ROUGHNESS;
D O I：
10.1002/ceat.202100558
中图分类号：
TQ [化学工业];
学科分类号：
0817 ;
摘要：
Copper surface is modified to copper oxide surface for high heat flux electronics applications. Copper oxide surface is prepared by chemical etching using NaOH and (NH4)(2)S2O8. A pool boiling experiment is conducted to investigate the critical heat flux (CHF) and boiling heat transfer coefficient (BHTC). The results indicate that BHTC of all copper oxide surfaces are enhanced remarkably. Bubble dynamics are also analyzed by means of a high-speed camera. Bubble visualization demonstrates that the active nucleation sites for the copper oxide surfaces are higher than the bare copper surface.
引用
收藏
页码：808 / 816
页数：9
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