Chip-scale packaging is ready for prime time

被引：0
作者：
Monticelli, D
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来源：
ELECTRONIC DESIGN | 2001年 / 49卷 / 03期
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暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
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页码：46 / 46
页数：1
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