Effect of BTI Degradation on Transistor Variability in Advanced Semiconductor Technologies

被引:64
作者
Pae, Sangwoo [1 ]
Maiz, Jose [1 ]
Prasad, Chetan [1 ]
Woolery, Bruce [1 ]
机构
[1] Intel Corp, Log Technol Dev Q&R, Hillsboro, OR 97124 USA
关键词
Bias temperature instability (BTI); high-kappa dielectrics; metal gate; SRAM; transistor reliability; Vccmin;
D O I
10.1109/TDMR.2008.2002351
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The effect of PMOS transistor negative bias temperature instability (NBTI) on product performance is a key reliability concern. As technology scales and device dimensions shrink, the trend in the V-T variability at both time zero and after NBTI aging increases. The time0 V-T variability can be explained by the random nature of dopants, whereas the randomly generated defects in the gate oxide can account for the aging-induced device Delta V-T variability. This paper focuses on the bias temperature instability stress-induced device Delta V-T variability and the trend across several technology generations. The remarkable correlation of aging-induced Delta V-T variability to the gate oxide area suggests that the continued device geometry scaling will increase the aging-induced variability. For the first time, aging-induced Delta V-T variability was characterized on transistors fabricated with high-kappa gate dielectric that also showed similar dependence to the gate oxide area.
引用
收藏
页码:519 / 525
页数:7
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