Development of RF/Microwave on-chip inductors using an organic micromachining process

被引:3
作者
Ramachandran, R [1 ]
Newlin, D [1 ]
Pham, A [1 ]
机构
[1] Clemson Univ, Holcombe Dept Elect & Comp Engn, Clemson, SC 29631 USA
来源
ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING | 2001年
关键词
inductors; micromachining; organic; RF;
D O I
10.1109/EPEP.2001.967620
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
We present the design and development of on-chip inductors using an organic micromachining process for R-F and Microwave applications. The process employs an SU-8 negative photoresist for developing micromachined structures using standard lithography techniques and is compatible with post-IC process to integrate passive devices onto foundry-fabricated circuits. Our initial results demonstrate that a spiral inductor fabricated on Si using this technology achieves a measured Q-factor of 20 at 2.1GHz. Further refinement of the process and design will increase the Q-factor to 60 as predicted by electromagnetic simulations. At the meeting we will present the design and development of various inductor topologies, including gridded ground planes, for achieving high Q-factors.
引用
收藏
页码:97 / 100
页数:4
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