Cooling three integrated circuits by embedding them inside an inclined cavity using nano-encapsulated phase change material

Being heated Integrated Circuits (ICs) significantly reduces their efficiency, and cooling of ICs is one of the major problems of the electronics industry. In this study, three ICs were installed in the middle of an inclined square enclosure to be cooled by using the natural convection of water/Nano-Encapsulated Phase Change Material (NEPCM). The NEPCM's core was filled with a PCM called n-nonadecane with melting temperature of 30.44 degrees C, which adding them to the host fluid causes a significant improvement in the heat transfer process. In the present simulation, various parameters such as volume fraction of NEPCM (0 < phi < 3%), Rayleigh number (102 < Ra < 104), and inclined angle (0 < zeta < 60) were investigated on the heat transfer parameters from the surface of the ICs. At Rayleigh number of 102, the inclined angle had not influence on the total heat transfer rate; however, the inclined angle of 60 was optimal value at Rayleigh number of 104. Given that the total heat transfer rate was increased by 29% with injection of 3% volume fraction of NEPCM at Rayleigh number of 104.