Material innovation and mechanics design for substrates and encapsulation of flexible electronics: a review

被引:151
作者
Li, Haibo [1 ]
Ma, Yinji [1 ]
Huang, Yonggang [2 ]
机构
[1] Tsinghua Univ, Dept Engn Mech, Ctr Flexible Elect Technol, Beijing 100084, Peoples R China
[2] Northwestern Univ, Dept Civil & Environm Engn, Dept Mech Engn, Dept Mat Sci & Engn,Ctr Biointegrated Elect, Evanston, IL 60208 USA
基金
中国国家自然科学基金;
关键词
ATOMIC LAYER DEPOSITION; LIGHT-EMITTING-DIODES; THIN-FILM ENCAPSULATION; TO-ROLL ENCAPSULATION; BARRIER FILMS; POLYETHYLENE TEREPHTHALATE; STRETCHABLE ELECTRONICS; THERMAL-CONDUCTIVITY; NANOCLAY COMPOSITE; ALUMINUM-OXIDE;
D O I
10.1039/d0mh00483a
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
Advances in materials and mechanics designs have led to the development of flexible electronics, which have important applications to human healthcare due to their good biocompatibility and conformal integration with biological tissue. Material innovation and mechanics design have played a key role in designing the substrates and encapsulations of flexible electronics for various bio-integrated systems. This review first introduces the inorganic materials and novel organic materials used for the substrates and encapsulation of flexible electronics, and summarizes their mechanics properties, permeability and optical transmission properties. The structural designs of the substrates are then introduced to ensure the reliability of flexible electronics, including the patterned and pre-strained designs to improve the stretchability, and the strain-isolation and -limiting substrates to reduce the deformation. Some emerging encapsulations are presented to protect the flexible electronics from degradation, environmental erosion or contamination, though they may slightly reduce the stretchability of flexible electronics.
引用
收藏
页码:383 / 400
页数:18
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