Influence of thermal cycling on dentin bond strengths of single-step self-etch adhesive systems

This study investigated the influence of thermal cycling on the dentin bond strengths of single-step self-etch adhesive systems. The Absolute, Clearfil Tri-S Bond, G-Bond and One-Up Bond F Plus systems were used. Bovine mandibular incisors were mounted in self-curing resin, and the facial surfaces were wet ground with #600 SiC paper. Adhesives were applied to the prepared dentin surfaces, and they were light irradiated according to each manufacturer's instructions. Resin composites were condensed into a mold (4 mm in diameter and 2 mm in height) and light irradiated for 30 seconds. Bonded specimens were divided into three groups and subjected to different storage conditions as follows: 37 degrees C water for 24 hours; 37 degrees C water for 24 hours followed by 10,000 thermal cycles between 5 degrees C and 60 degrees C or 37 degrees C water for 24 hours followed by 20,000 thermal cycles between WC and 60 degrees C. Ten samples per group were tested in a shear mode at a crosshead speed of 1.0 mm/minute. Analysis of variance and Tukey's HSD test at the 0.05 significance level were used to compare the three storage conditions for each adhesive system. After 24 hours storage in water, the mean dentin bond strengths ranged from 11.4 NIPa to 17.1 MPa. The Clearfil Tri-S Bond system showed the highest bond strength. After 10,000 thermal cycles, the mean bond strengths remained unchanged except for those of the Clearfil Tri-S Bond system, which significantly increased. Significant decreases in bond strength were observed for the Absolute and One-Up Bond F Plus systems after 20,000 thermal cycles. Failure mode was commonly due to adhesive breakdown associated with partial cohesive failure of the adhesive resin. From the results of this study, in terms of simplifying the clinical procedure, the benefit of using single-step self-etch systems might be acceptable.