Effect of temperature on oxide formation in ligand-deficient Cu|Cu(II), ethylenediamine system

被引：6

作者：

Surviliené, A ^{[1
]}

Survila, A ^{[1
]}

机构：

[1] Inst Chem, Dept Met Electrochem, LT-2600 Vilnius, Lithuania

来源：

RUSSIAN JOURNAL OF ELECTROCHEMISTRY | 2002年 / 38卷 / 11期

关键词：

D O I：

10.1023/A:1021105911380

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

The influence of temperature on formation of oxide layers on copper electrode in solutions containing 0.01 M Cu(II), 0.005 M ethylenediamine, and 0.3 M K2SO4 as a supporting electrolyte at pH 5.3 is investigated. The rate of net process Cu + Cu2+ + H2O --> Cu2O + 2H(+) proceeding under open-circuit conditions is supposedly controlled by interaction between copper electrode and Cu2+ aqua-ions. Well-defined voltammetric peak is observed at -0.75 V (SHE), the height of which may serve as a measure of Cu2O formation rate. An activation energy and a formal rate constant of the process are found to equal 30 kJ mol(-1) and 0.17 s(-1).

引用

页码：1216 / 1219

页数：4

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