Numerical analysis of SiC merged PiN Schottky diodes

被引:2
作者
Ayalew, T
Kim, SC
Grasser, T
Selberherr, S
机构
[1] Vienna Univ Technol, Inst Microelect, A-1040 Vienna, Austria
[2] Korea Electrotechnol Res Inst, Power Semicond Res Grp, Chang Won 641120, Gyungnam, South Korea
来源
SILICON CARBIDE AND RELATED MATERIALS 2004 | 2005年 / 483卷
关键词
simulation; SiC; power rectifier; MPS diode; switching speed; leakage current;
D O I
10.4028/www.scientific.net/MSF.483-485.949
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
We present numerical simulation results of 1500-V SiC merged PiN Schottky (MPS) diode which exhibited Schottky-like on-state and switching characteristics, and PiN-like off-state characteristics. The key parameters that alter the overall device performance have been optimized using the device simulator MINIMOS-NT. The Schottky spacing between the adjacent p+ implanted regions has been varied so that a trade-off between the forward current capability and lower reverse leakage current can be investigated. MPS diodes have shown reliable avalanche operations with blocking voltage of 1350 V which is 90% of the desired value, and a high current density magnitude of 900 A/cm2 for an on-state voltage drop of only 3 V.
引用
收藏
页码:949 / 952
页数:4
相关论文
共 50 条
  • [31] Influence of Temperature on Shockley Stacking Fault Expansion and Contraction in SiC PiN Diodes
    Joshua D. Caldwell
    Orest J. Glembocki
    Robert E. Stahlbush
    Karl D. Hobart
    Journal of Electronic Materials, 2008, 37 : 699 - 705
  • [32] Radiation tolerance comparison of silicon and 4H-SiC Schottky diodes
    Siddiqui, Amna
    Usman, Muhammad
    MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 2021, 135
  • [33] Influence of temperature on Shockley stacking fault expansion and contraction in SiC PiN diodes
    Caldwell, Joshua D.
    Glembocki, Orest J.
    Stahlbush, Robert E.
    Hobart, Karl D.
    JOURNAL OF ELECTRONIC MATERIALS, 2008, 37 (05) : 699 - 705
  • [34] Investigation of barrier inhomogeneities in Mo/4H-SiC Schottky diodes
    Boussouar, L.
    Ouennoughi, Z.
    Rouag, N.
    Sellai, A.
    Weiss, R.
    Ryssel, H.
    MICROELECTRONIC ENGINEERING, 2011, 88 (06) : 969 - 975
  • [35] Influence of annealing on reverse current of 4H-SiC Schottky diodes
    Sochacki, M
    Szmidt, J
    Bakowski, M
    Werbowy, A
    DIAMOND AND RELATED MATERIALS, 2002, 11 (3-6) : 1263 - 1267
  • [36] High-temperature characteristics of SiC Schottky barrier diodes related to physical phenomena
    Funaki, Tsuyoshi
    Kimoto, Tsunenobu
    Hikihara, Takashi
    IEICE ELECTRONICS EXPRESS, 2008, 5 (06) : 198 - 203
  • [37] TEM of dislocations in forward-biased 4H-SiC PiN diodes
    Zhang, M
    Lendenmann, H
    Pirouz, P
    SILICON CARBIDE AND RELATED MATERIALS 2003, PTS 1 AND 2, 2004, 457-460 : 359 - 362
  • [38] Study of 4H-SiC JBS Diodes Fabricated with Tungsten Schottky Barrier
    M. Berthou
    P. Godignon
    J. Montserrat
    J. Millan
    D. Planson
    Journal of Electronic Materials, 2011, 40 : 2355 - 2362
  • [39] Barrier height homogeneity for 4.5 kV 4H-SiC Schottky diodes
    Bluet, J. M.
    Ziane, D.
    Guillot, G.
    Tournier, D.
    Brosselard, P.
    Montserrat, J.
    Godignon, P.
    SUPERLATTICES AND MICROSTRUCTURES, 2006, 40 (4-6) : 399 - 404
  • [40] TCAD evaluation of single-event burnout hardening design for SiC Schottky diodes
    Chen, Jia-Hao
    Wang, Ying
    Guo, Hao-min
    Fei, Xin-Xing
    Yu, Cheng-hao
    Bao, Meng-Tian
    MICROELECTRONICS RELIABILITY, 2022, 139