共 19 条
- [1] BORLAND W, 1988, MAT RES SOC, V108, P382
- [2] CHOTE RE, 1995, HDB MAT ELECT PACKAV, P187
- [4] METHOD FOR THE RHEOLOGICAL CHARACTERIZATION OF THICK-FILM PASTES [J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1979, 2 (02): : 232 - 239
- [5] KOZEL BLR, 1984, SOLID STATE TECH AUG, P167
- [6] KUO CY, 1987, P INT S HYBR MICR 6, V1, P562
- [7] THICK-FILM TECHNOLOGY - AN INTRODUCTION TO THE MATERIALS [J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1980, 3 (02): : 211 - 225
- [9] MILLER LF, 1974, SOLID STATE TECH OCT, P54
- [10] EFFECT OF INORGANIC BINDERS ON THE PROPERTIES OF THICK-FILM COPPER CONDUCTOR [J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A, 1994, 17 (04): : 625 - 630