Effects of Filler Configuration and Moisture on Dissipation Factor and Critical Electric Field of Epoxy Composites for HV-ICs Encapsulation

被引:14
作者
Ahn, Woojin [1 ]
Cornigli, Davide [2 ,3 ]
Varghese, Dhanoop [4 ]
Nguyen, Luu [5 ]
Krishnan, Srikanth [4 ]
Reggiani, Susanna [2 ,3 ]
Alam, Muhammad Ashraful [1 ]
机构
[1] Purdue Univ, Dept ECE, W Lafayette, IN 47907 USA
[2] Univ Bologna, Adv Res Ctr Elect Syst E De Castro ARCES, Bologna, Italy
[3] Univ Bologna, Dept Elect DEI, I-40136 Bologna, Italy
[4] Texas Instruments Inc, Dallas, TX 75243 USA
[5] Texas Instruments Inc, Santa Clara, CA USA
来源
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | 2020年 / 10卷 / 09期
关键词
Moisture; Plastics; Compounds; Conductivity; Predictive models; Numerical models; Conductivity measurement; DC conductivity measurement; epoxy molding compounds (MCs); finite-element simulation; mass gain experiments; moisture diffusion; WATER-ABSORPTION; DIELECTRIC-PROPERTIES; PART I; DIFFUSION; CONDUCTIVITY; NANOCOMPOSITES; BREAKDOWN; RESIN; MODEL;
D O I
10.1109/TCPMT.2020.3015658
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Molding compounds (MCs) are widely used as an encapsulation material for integrated circuits; however, traditional MCs are susceptible to moisture and charge spreading over time. The increase in dissipation factor due to the increase of parasitic electrical conductivity (sigma) and the decrease in dielectric strength (ECrit MC) restrict their applications. Thus, a fundamental understanding of moisture transport as a function of MC parameters is essential to suppress moisture diffusion and broaden their applications. In this article, we: 1) propose a generalized effective medium and solubility (GEMS) Langmuir model by identifying a set of parameters that control water uptake as a function of filler configuration and relative humidity; 2) investigate the dominant impact of reacted-water on sigma through numerical simulations, mass-uptake, and dc conductivity measurements; 3) investigate electric field distribution to explain how moisture ingress reduces ECrit MC; and finally 4) optimize the filler configuration to lower the dissipation factor, and enhance ECrit MC. The GEMS-Langmuir model can be used for any application (e.g., photovoltaics, biosensors) where moisture ingress leads to reliability challenges.
引用
收藏
页码:1534 / 1541
页数:8
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