A Novel Method for Fabrication of High-Frequency (>100 MHz) ZnO Ultrasonic Array Transducers on Silicon Substrates

被引:0
|
作者
Zhang, J. Y. [1 ,2 ]
Gao, J. M. [1 ]
Xu, W. J. [1 ]
Carlier, J. [1 ]
Ji, X. M. [2 ]
Nongaillard, B. [1 ]
Huang, Y. P. [2 ]
Piwakowski, B. [1 ]
机构
[1] Univ Valenciennes, Dept Optoacoustoelect, IEMN, UMR CNRS 8520, Mt Houy BP311, F-59313 Valenciennes, France
[2] Fudan Univ, Dept Microelect, ASIC & Syst State Key Lab, Shanghai 200433, Peoples R China
来源
INTERNATIONAL CONGRESS ON ULTRASONICS (GDANSK 2011) | 2012年 / 1433卷
基金
美国国家科学基金会;
关键词
High-frequency; zinc oxide (ZnO) thin film; ultrasonic array transducer; micromachining;
D O I
10.1063/1.3703274
中图分类号
O59 [应用物理学];
学科分类号
摘要
High-frequency ultrasonic transducer arrays are essential for efficient imaging in clinical analysis and nondestructive evaluation (NDE). However, the fabrication of piezoelectric transducers is really a great challenge due to the small features in an array. A novel technique is presented to fabricate thick-film ZnO ultrasonic array transducers. Piezoelectric elements are formed by sputtering thick-film ZnO onto etched features of a silicon substrate so that the difficult etching process for ZnO films is avoided by etching silicon. This process is simple and efficient. A 13-mu m-pitch ZnO sandwich array is achieved with a thickness of 8 mu m for 300 MHz. Finite element method is employed to simulate the wave propagation in water based on this new transducer configuration. The acoustic field results indicate this configuration has an acceptable performance. A potential application is proposed based on integration with microfluidics.
引用
收藏
页码:679 / 682
页数:4
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