Electrochemical Synthesis of Dendrite-like Cu catalysts for Electroless Deposition of Cu Circuits

被引：0

作者：

Zhong, Zhe ^{[1
,2
]}

Xie, Jinqi ^{[1
]}

Zhang, Kai ^{[3
]}

Yuen, Matthew M. F. ^{[3
]}

Fu, Xian-Zhu ^{[1
]}

Sun, Rong ^{[1
]}

Wong, Ching-Ping ^{[4
]}

机构：

[1] Chinese Acad Sci, Guangdong Prov Key Lab Mat High Dens Elect Packag, Shenzhen High Dens Elect Packaging & Device Assem, Shenzhen Inst Adv Technol, Shenzhen 518055, Peoples R China

[2] Nanchang Univ, Sch Mat Sci & Engn, Nanchang 330000, Peoples R China

[3] Hong Kong Univ Sci & Technol, Dept Mech & Aerosp Engn, Hong Kong, Hong Kong, Peoples R China

[4] Chinese Univ Hong Kong, Dept Elect Engn, Hong Kong, Hong Kong, Peoples R China

来源：

2016 17TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) | 2016年

关键词：

dendrite-like Cu; electroless deposition; circuit; Pd coated Cu; catalyst;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Dendrite-like Cu supported Pd catalysts were prepared for electroless deposition of Cu circuits. The as-preapred catalysts demonstrated excellent catalytic activity.

引用

页码：341 / 343

页数：3

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