On the thermal conductivity of Cu-Zr/diamond composites

被引：149
作者：
Chu, Ke [1 ]
Jia, Chengchang [2 ]
Guo, Hong [3 ]
Li, Wensheng [1 ]
机构：
[1] Lanzhou Univ Technol, State Key Lab Gansu Adv Nonferrous Met Mat, Lanzhou 730050, Peoples R China
[2] Univ Sci & Technol Beijing, Sch Mat Sci & Engn, Beijing 100083, Peoples R China
[3] Gen Res Inst Nonferrous Met, Nonferrous Met Proc Div, Beijing 100088, Peoples R China
来源：
MATERIALS & DESIGN | 2013年 / 45卷
关键词：
Cu/diamond composites; Microstructure; Thermal conductivity; Modeling; METAL-MATRIX COMPOSITES; HEAT SINK APPLICATIONS; CU/DIAMOND COMPOSITES; POWDER-METALLURGY; DIAMOND COMPOSITES; COPPER MATRIX; MICROSTRUCTURE; CARBIDE; BORON; INFILTRATION;
D O I：
10.1016/j.matdes.2012.09.006
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Interfaces and close proximity between the diamond and the metal matrix are very important for their thermal conductance performance. Matrix-alloying is a useful approach to greatly enhance the interfacial bonding and thermal conductivity. In this study, the copper-diamond (Cu/Dia) composites with addition of 0.8, 1.2 and 2.4 wt.% zirconium (Zr) are prepared to investigate the influence of minor addition of Zr on the microstructure and thermal conductivity of the composites. The thermal conductivity of the composites is analyzed both experimentally and theoretically. It is demonstrated that moderate interfacial modification due to the Zr added is beneficial to improve the thermal conductivity of the Cu/Dia composites. (c) 2012 Elsevier Ltd. All rights reserved.
引用
收藏
页码：36 / 42
页数：7
相关论文
共 35 条
[1]   High thermal conductivity composite of diamond particles with tungsten coating in a copper matrix for heat sink application [J].
Abyzov, Andrey M. ;
Kidalov, Sergey V. ;
Shakhov, Fedor M. .
APPLIED THERMAL ENGINEERING, 2012, 48 :72-80
[2]   High thermal conductivity composites consisting of diamond filler with tungsten coating and copper (silver) matrix [J].
Abyzov, Andrey M. ;
Kidalov, Sergey V. ;
Shakhov, Fedor M. .
JOURNAL OF MATERIALS SCIENCE, 2011, 46 (05) :1424-1438
[3]   On the thermal and chemical stability of diamond during processing of Al/diamond composites by liquid metal infiltration (squeeze casting) [J].
Beffort, O ;
Vaucher, S ;
Khalid, FA .
DIAMOND AND RELATED MATERIALS, 2004, 13 (10) :1834-1843
[4]   THE EFFECTIVE CONDUCTIVITY OF COMPOSITES WITH IMPERFECT THERMAL CONTACT AT CONSTITUENT INTERFACES [J].
BENVENISTE, Y ;
MILOH, T .
INTERNATIONAL JOURNAL OF ENGINEERING SCIENCE, 1986, 24 (09) :1537-1552
[5]   Temperature dependence of thermal conductivity in SiCp based metal-matrix composites [J].
Chu, K. ;
Jia, C. C. ;
Liang, X. B. ;
Chen, H. .
MATERIALS SCIENCE AND TECHNOLOGY, 2011, 27 (01) :91-94
[6]   Thermal Properties of Carbon Nanotube-Copper Composites for Thermal Management Applications [J].
Chu, Ke ;
Guo, Hong ;
Jia, Chengchang ;
Yin, Fazhang ;
Zhang, Ximin ;
Liang, Xuebing ;
Chen, Hui .
NANOSCALE RESEARCH LETTERS, 2010, 5 (05) :868-874
[7]   Thermal conductivity of SPS consolidated Cu/diamond composites with Cr-coated diamond particles [J].
Chu, Ke ;
Liu, Zhaofang ;
Jia, Chengchang ;
Chen, Hui ;
Liang, Xuebing ;
Gao, Wenjia ;
Tian, Wenhuai ;
Guo, Hong .
JOURNAL OF ALLOYS AND COMPOUNDS, 2010, 490 (1-2) :453-458
[8]   Fabrication and effective thermal conductivity of multi-walled carbon nanotubes reinforced Cu matrix composites for heat sink applications [J].
Chu, Ke ;
Wu, Qingying ;
Jia, Chengchang ;
Liang, Xuebing ;
Nie, Junhui ;
Tian, Wenhuai ;
Gai, Guosheng ;
Guo, Hong .
COMPOSITES SCIENCE AND TECHNOLOGY, 2010, 70 (02) :298-304
[9]   Thermal conductivity of spark plasma sintering consolidated SiCp/Al composites containing pores: Numerical study and experimental validation [J].
Chu, Ke ;
Jia, Chengchang ;
Tian, Wenhuai ;
Liang, Xuebing ;
Chen, Hui ;
Guo, Hong .
COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, 2010, 41 (01) :161-167
[10]   The thermal conductivity of pressure infiltrated SiCp/Al composites with various size distributions: Experimental study and modeling [J].
Chu, Ke ;
Jia, Chengchang ;
Liang, Xuebing ;
Chen, Hui ;
Guo, Hong .
MATERIALS & DESIGN, 2009, 30 (09) :3497-3503
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