Development of lead-free Sn-3.5Ag/SnO2 nanocomposite solders

被引：45
|
作者：
Babaghorbani, P. [1 ]
Nai, S. M. L. [1 ]
Gupta, M. [1 ]
机构：
[1] Natl Univ Singapore, Dept Mech Engn, Singapore 117576, Singapore
来源：
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS | 2009年 / 20卷 / 06期
关键词：
METAL-MATRIX COMPOSITES; MECHANICAL-PROPERTIES; COOLING RATE; MICROWAVE; BEHAVIOR; MICROSTRUCTURE; STRENGTH; REINFORCEMENT; PERFORMANCE; DUCTILITY;
D O I：
10.1007/s10854-008-9767-1
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In the present study, feasibility of using SnO2 as reinforcement in Sn-3.5Ag is assessed. Energy-efficient microwave assisted powder metallurgy route was used for synthesis of materials. Characterization results revealed that best combination of hardness and tensile strength was realized with 0.7 vol% of SnO2 in solder matrix. An attempt is made to correlate mechanical properties of Sn-3.5Ag with the increasing presence of SnO2 particulates at the nanometer length scale.
引用
收藏
页码：571 / 576
页数：6
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