Development of lead-free Sn-3.5Ag/SnO2 nanocomposite solders

被引：46

作者：

Babaghorbani, P. ^{[1
]}

Nai, S. M. L. ^{[1
]}

Gupta, M. ^{[1
]}

机构：

[1] Natl Univ Singapore, Dept Mech Engn, Singapore 117576, Singapore

来源：

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS | 2009年 / 20卷 / 06期

关键词：

METAL-MATRIX COMPOSITES; MECHANICAL-PROPERTIES; COOLING RATE; MICROWAVE; BEHAVIOR; MICROSTRUCTURE; STRENGTH; REINFORCEMENT; PERFORMANCE; DUCTILITY;

D O I：

10.1007/s10854-008-9767-1

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In the present study, feasibility of using SnO2 as reinforcement in Sn-3.5Ag is assessed. Energy-efficient microwave assisted powder metallurgy route was used for synthesis of materials. Characterization results revealed that best combination of hardness and tensile strength was realized with 0.7 vol% of SnO2 in solder matrix. An attempt is made to correlate mechanical properties of Sn-3.5Ag with the increasing presence of SnO2 particulates at the nanometer length scale.

引用

页码：571 / 576

页数：6

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