Effects of interface area density and solid solution on the microhardness of Cu-Nb microcomposite wires

被引：24
|
作者：
Deng, Liping [1 ]
Liu, Zhifeng [1 ]
Wang, Bingshu [2 ]
Han, Ke [3 ]
Xiang, Hongliang [1 ]
机构：
[1] Fuzhou Univ, Sch Mech Engn & Automat, Fuzhou 350116, Fujian, Peoples R China
[2] Fuzhou Univ, Coll Mat Sci & Engn, Fuzhou 350116, Fujian, Peoples R China
[3] Natl High Magnet Field Lab, Tallahassee, FL 32310 USA
来源：
MATERIALS CHARACTERIZATION | 2019年 / 150卷
基金：
中国国家自然科学基金; 美国国家科学基金会;
关键词：
Cu-Nb microcomposite wires; Interface; Solid solution; Microhardness; MECHANICAL-PROPERTIES; HIGH-STRENGTH; MICROSTRUCTURE EVOLUTION; ELECTRICAL-CONDUCTIVITY; THERMAL-STABILITY; COMPOSITE WIRES; NANOCOMPOSITE; BEHAVIOR; NIOBIUM; COPPER;
D O I：
10.1016/j.matchar.2019.02.002
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Cu-Nb microcomposite wires drawn to different strain values were studied by means of scanning electron microscopy and transmission electron microscopy. The Cu and Nb near the interfaces show a typical Kurdjumov-Sachs relationship with a deviation angle of 12 degrees. This deviation accommodates internal stresses and slip discontinuity between Cu and Nb. The dislocations are mainly stored around the interface near the Cu matrix. Lattice distortion occurred near the interfaces, where Nb is believed to mix into Cu matrix. Microhardness is affected by interface area density as well as by strain-induced lattice distortion, which can produce a supersaturated solid solution.
引用
收藏
页码：62 / 66
页数：5
相关论文
共 50 条
  • [1] Thermite welding of Cu-Nb microcomposite wires
    Visniakov, Nikolaj
    Mikalauskas, Gediminas
    Skamat, Jelena
    Lukauskaite, Raimonda
    Cernasejus, Olegas
    Rudzinskas, Vitalijus
    Boris, Renata
    INTERNATIONAL JOURNAL OF MATERIALS RESEARCH, 2017, 108 (10) : 832 - 839
  • [2] Thermal stability of Cu-Nb microcomposite wires
    Deng, Liping
    Han, Ke
    Wang, Bingshu
    Yang, Xiaofang
    Liu, Qing
    ACTA MATERIALIA, 2015, 101 : 181 - 188
  • [3] Effect of Extra Cu on the Strength and Conductivity of Cu-Nb Microcomposite Wires
    Deng Liping
    Han Ke
    Yang Xiaofang
    Sun Zeyuan
    Liu Qing
    RARE METAL MATERIALS AND ENGINEERING, 2015, 44 (07) : 1696 - 1701
  • [4] Quality Analysis of Welded and Soldered Joints of Cu-Nb Microcomposite Wires
    Visniakov, Nikolaj
    Novickij, Jurij
    Scekaturoviene, Danute
    Petrauskas, Adomas
    MATERIALS SCIENCE-MEDZIAGOTYRA, 2011, 17 (01): : 16 - 19
  • [5] Effect of groove rolling on the microstructure and properties of Cu-Nb microcomposite wires
    Wang, Peng-fei
    Liang, Ming
    Xu, Xiao-yan
    Feng, Jian-qing
    Li, Cheng-shan
    Zhang, Ping-xiang
    Li, Jin-shan
    INTERNATIONAL JOURNAL OF MINERALS METALLURGY AND MATERIALS, 2021, 28 (02) : 279 - 284
  • [6] Effect of groove rolling on the microstructure and properties of Cu-Nb microcomposite wires
    Peng-fei Wang
    Ming Liang
    Xiao-yan Xu
    Jian-qing Feng
    Cheng-shan Li
    Ping-xiang Zhang
    Jin-shan Li
    International Journal of Minerals, Metallurgy and Materials, 2021, 28 : 279 - 284
  • [7] Effects of interface density on mechanical and electrical properties of annealed Cu-Nb nanocomposite wires
    Xiang, Shihua
    Yang, Xiaofang
    Qiu, Youcai
    Li, Jingxiao
    Liang, Yanxiang
    Xu, Junyao
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2022, 856
  • [8] Evolution of radial texture and microhardness of Cu-Nb composite wires
    Deng L.
    Liu Y.
    Yang J.
    Wang B.
    Yang X.
    Deng, Liping (ldeng@fzu.edu.cn), 1600, Chinese Journal of Materials Research (30): : 848 - 854
  • [9] Microstructural stability of Cu-Nb microcomposite wires fabricated by the bundling and drawing process
    Ig Hong, Sun
    Hill, Mary Ann
    Materials Science and Engineering A, 2000, 281 (01) : 189 - 197
  • [10] Microstructural stability of Cu-Nb microcomposite wires fabricated by the bundling and drawing process
    Hong, SI
    Hill, MA
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2000, 281 (1-2): : 189 - 197
12345