Inductively coupled plasma reactive ion etching of ZnO using BCI3-based plasmas

被引:54
作者
Kim, HK [1 ]
Bae, JW
Kim, TK
Kim, KK
Seong, TY
Adesida, I
机构
[1] Univ Illinois, Micro & Nanotechnol Lab, Urbana, IL 61801 USA
[2] Univ Illinois, Dept Elect & Comp Engn, Urbana, IL 61801 USA
[3] K JIST, Dept Mat Sci & Engn, Kwangju 500712, South Korea
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 2003年 / 21卷 / 04期
关键词
D O I
10.1116/1.1575250
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Etching characteristics of ZnO are investigated by means of inductively coupled plasma (ICP) reactive ion etching in BCl3-based plasmas. Etch rates are studied as a function of BCl3/Cl-2/Ar chemistries, substrate temperature, ICP coil power, rf power, and working pressure. Surface profilometer, scanning electron microscopy, and atomic force microscopy are used to characterize etch rates. etch profiles, and the surface morphologies of etched samples. It is shown that the etch rate is determined by the BCl3 content in the plasma. Auger electron spectroscopy results demonstrate that the BCl3-based etching process produces negligible changes in the surface stoichiometry of ZnO. (C) 2003 American Vacuum Society.
引用
收藏
页码:1273 / 1277
页数:5
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