Shielded passive devices for silicon-based monolithic microwave and millimeter-wave integrated circuits

被引:245
作者
Cheung, TSD [1 ]
Long, JR
机构
[1] Univ Toronto, Dept Elect & Comp Engn, Toronto, ON M5S 3G4, Canada
[2] Delft Univ Technol, Elect Res Lab, DIMES, NL-2628 CD Delft, Netherlands
关键词
bondpads; coplanar transmission lines; floating shield; inductors; mill imeter-wave integrated circuits; MMICs; on-chip interconnects; patterned ground shield; silicon; slow-wave transmission lines; substrate loss; transformers;
D O I
10.1109/JSSC.2006.872737
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper introduces floating shields for on-chip transmission lines, inductors, and transformers implemented in production silicon CMOS or BiCMOS technologies. The shield minimizes losses without requiring an explicit on-chip ground connection. Experimental measurements demonstrate Q-factor ranging from 25 to 35 between 15 and 40 GHz for shielded coplanar waveguide fabricated on 10 Omega(.)cm silicon. This is more than a factor of 2 improvement over conventional on-chip transmission lines (e.g., microstrip, CPW). A floating-shielded, differentially driven 7.4-nH inductor demonstrates a peak Q of 32, which is 35% higher than an unshielded example. Similar results are realizable for on-chip transformers. Floating-shielded bondpads with 15% less parasitic capacitance and over 60% higher shunt equivalent resistance compared to conventional shielded bondpads are also described. Implementation of floating shields is compatible with current and projected design constraints for production deep-submicron silicon technologies without process modifications. Application examples of floating-shielded passives implemented in a 0.18-mu m SiGe-BiCMOS are presented, including a 21-26-GHz power amplifier with 23-dBm output at 20% PAE (at 22 GHz), and a 17-GHz WLAN image-reject receiver MMIC which dissipates less than 65 mW from a 2-V supply.
引用
收藏
页码:1183 / 1200
页数:18
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