共 48 条
[1]
Wafer-level packaging technology for extended global wiring and inductors
[J].
ESSDERC 2003: PROCEEDINGS OF THE 33RD EUROPEAN SOLID-STATE DEVICE RESEARCH CONFERENCE,
2003,
:103-106
[5]
Effects of dummy patterns and substrate on spiral inductors for sub-micron RF ICs
[J].
2002 IEEE RADIO FREQUENCY INTEGRATED CIRCUITS (RFIC) SYMPOSIUM, DIGEST OF PAPERS,
2002,
:419-422
[7]
Chen YE, 2001, IEEE MTT-S, P1289, DOI 10.1109/MWSYM.2001.967129
[8]
A 21-27GHz self-shielded 4-way power-combining PA balm
[J].
PROCEEDINGS OF THE IEEE 2004 CUSTOM INTEGRATED CIRCUITS CONFERENCE,
2004,
:617-620
[9]
Differentially-shielded monolithic inductors
[J].
PROCEEDINGS OF THE IEEE 2003 CUSTOM INTEGRATED CIRCUITS CONFERENCE,
2003,
:95-98
[10]
Cheung TSD, 2003, ISSCC DIG TECH PAP I, V46, P396