Thermal conductivity enhancement in carbon nanotube/Cu-Ti composites

被引：27
|
作者：
Chu, Ke [1 ]
Jia, Cheng-chang [2 ]
Li, Wen-sheng [1 ]
机构：
[1] Lanzhou Univ Technol, State Key Lab Gansu Adv Nonferrous Met Mat, Lanzhou 730050, Peoples R China
[2] Univ Sci & Technol Beijing, Sch Mat Sci & Engn, Beijing 100083, Peoples R China
来源：
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING | 2013年 / 110卷 / 02期
关键词：
MATRIX COMPOSITES; COPPER ALLOY; INTERFACE; ALUMINUM;
D O I：
10.1007/s00339-012-7450-0
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Carbon nanotube reinforced Cu-Ti alloy (CNT/Cu-Ti) composites are fabricated by a powder metallurgical method. The interfacial bonding of CNT/Cu-Ti composites is evidently improved, which is attributed to the formation of a thin layer of TiC at the interface. The thermal conductivity of the composites increases by 7.5 % and 15.1 % compared to that of Cu-Ti matrix at CNT loadings of 5 vol.% and 10 vol.%, respectively. The matrix-alloying is therefore an effective way to enhance the thermal conductivity of CNT/Cu composites.
引用
收藏
页码：269 / 273
页数：5
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