Antibacterial Ti-Cu implants: A critical review on mechanisms of action

被引：71

作者：

Mahmoudi, Pezhman ^{[1
]}

Akbarpour, Mohammad Reza ^{[2
]}

Lakeh, Hengame Babaei ^{[3
]}

Jing, Fengjuan ^{[4
]}

Hadidi, Mohammad Reza ^{[5
]}

Akhavan, Behnam ^{[6
,7
]}

机构：

[1] Sharif Univ Technol, Dept Mat Sci & Engn, Tehran 113659466, Iran

[2] Univ Maragheh, Dept Mat Engn, POB 55136-553, Maragheh, Iran

[3] Islamic Azad Univ Med Sci, Tehran, Iran

[4] Southwest Jiaotong Univ, Sch Mat Sci & Engn, Key Lab Adv Technol Mat, Minist Educ China, Chengdu 610031, Peoples R China

[5] Oklahoma State Univ, Sch Mech & Aerosp Engn, Stillwater, OK 74078 USA

[6] Univ Newcastle, Sch Engn, Callaghan, NSW 2308, Australia

[7] Hunter Med Res Inst HMRI, Precis Med Res Program, New Lambton Hts, NSW 2305, Australia

来源：

MATERIALS TODAY BIO | 2022年 / 17卷

基金：

澳大利亚研究理事会;

关键词：

Antibacterial mechanisms; Ti-Cu implants; Contact killing; Ion releasing; Anti-infection; Biomaterials; Antimicrobial; METAL-OXIDE NANOPARTICLES; BEARING TITANIUM-ALLOY; COPPER SINTERED ALLOY; IN-VITRO; STAPHYLOCOCCUS-AUREUS; BACTERIAL ADHESION; ANTIMICROBIAL ACTIVITY; SILVER NANOPARTICLES; CORROSION-RESISTANCE; BIOFILM FORMATION;

D O I：

10.1016/j.mtbio.2022.100447

中图分类号：

R318 [生物医学工程];

学科分类号：

0831 ;

摘要：

Titanium (Ti) has been widely used for manufacturing of bone implants because of its mechanical properties, biological compatibility, and favorable corrosion resistance in biological environments. However, Ti implants are prone to infection (peri-implantitis) by bacteria which in extreme cases necessitate painful and costly revision surgeries. An emerging, viable solution for this problem is to use copper (Cu) as an antibacterial agent in the alloying system of Ti. The addition of copper provides excellent antibacterial activities, but the underpinning mechanisms are still obscure. This review sheds light on such mechanisms and reviews how incorporation of Cu can render Ti-Cu implants with antibacterial activity. The review first discusses the fundamentals of interactions between bacteria and implanted surfaces followed by an overview of the most common engineering strategies utilized to endow an implant with antibacterial activity. The underlying mechanisms for antibacterial activity of Ti-Cu implants are then discussed in detail. Special attention is paid to contact killing mechanisms because the misinterpretation of this mechanism is the root of discrepancies in the literature.

引用

页数：24

共 264 条

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