Exploring Carbon Nanotubes for VLSI Interconnects

被引：0

作者：

Santos, Joshua A. ^{[1
]}

Kelly, Troy F., Jr. ^{[1
]}

Ullah, Muhammad S. ^{[1
]}

机构：

[1] Florida Polytech Univ, Dept Elect & Comp Engn, Lakeland, FL 33805 USA

来源：

2019 IEEE 62ND INTERNATIONAL MIDWEST SYMPOSIUM ON CIRCUITS AND SYSTEMS (MWSCAS) | 2019年

关键词：

Multi-wall Carbon Nanotube; Propagation Delay; VLSI Interconnect; MODEL;

D O I：

10.1109/mwscas.2019.8885390

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

As a result of a decrease in cross-section, increases have been noted in several thermal and electrical properties of copper interconnects. To mitigate such concerns, new approaches are being considered for new wiring solutions for VLSI technologies. The incorporation of carbon nanotubes (CNTs) in VLSI design to replace existing interconnection material, may be an efficient and cost-effective evolution from current materials. Carbon nanotubes, more specifically multi-walled carbon nanotubes (MWCNT), have been identified as potential alternatives to diminish such concerns. This paper will delineate the shared and differing aspects of each of the CNT structures.

引用

页码：1122 / 1126

页数：5

共 50 条

[41] Impact of Parameters Variability on the Electrical Performance of Carbon Nanotube Interconnects [J].

Stievano, I. S. ;

Manfredi, P. ;

Canavero, F. G. .

2011 15TH IEEE WORKSHOP ON SIGNAL PROPAGATION ON INTERCONNECTS (SPI), 2011, :83-86

[42] Analysis of Delay and Dynamic Crosstalk in Bundled Carbon Nanotube Interconnects [J].

Majumder, Manoj Kumar ;

Kaushik, B. K. ;

Manhas, Sanjeev Kumar .

IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 2014, 56 (06) :1666-1673

[43] Carbon-nanotube-based wireless on-chip interconnects [J].

Franck, P. ;

Baillargeat, D. ;

Tay, B. K. .

2016 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM (IMS), 2016,

[44] Carbon Nanostructures Dedicated to Millimeter-Wave to THz Interconnects [J].

Brun, Christophe ;

Wei, Tan Chong ;

Franck, Pierre ;

Chong, Yap Chin ;

Lu Congxiang ;

Leong, Chow Wai ;

Tan, Dunlin ;

Kang, Tay Beng ;

Coquet, Philippe ;

Baillargeat, Dominique .

IEEE TRANSACTIONS ON TERAHERTZ SCIENCE AND TECHNOLOGY, 2015, 5 (03) :383-390

[45] Nichols stability analysis in multiwall carbon nanotube based interconnects [J].

Fotoohi, Somayeh ;

Haji-Nasiri, Saeed .

BULGARIAN CHEMICAL COMMUNICATIONS, 2015, 47 :35-37

[46] Evaluating Carbon Nanotube Global Interconnects for Chip Multiprocessor Applications [J].

Pasricha, Sudeep ;

Kurdahi, Fadi J. ;

Dutt, Nikil .

IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 2010, 18 (09) :1376-1380

[47] Signal Integrity Analysis of Carbon Nanotube on-chip Interconnects [J].

Chiariello, A. G. ;

Maffucci, A. ;

Miano, G. .

2009 IEEE WORKSHOP ON SIGNAL PROPAGATION ON INTERCONNECTS, 2009, :33-+

[48] High Frequency and Crosstalk Analysis of VLSI Carbon Nanotube Nanointerconnects [J].

Chiariello, A. G. ;

Maffucci, A. ;

Miano, G. ;

Villone, F. .

EMC EUROPE: 2009 INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY, 2009, :9-+

[49] Carbon nanotubes with periodic vacancy defects to phenine nanotubes: A DFT study [J].

Sharma, Amrish ;

Mudahar, Isha ;

Sharma, Hitesh .

COMPUTATIONAL AND THEORETICAL CHEMISTRY, 2022, 1211

[50] Structural mechanics approach for Carbon Nanotubes [J].

Rajasekaran, S. ;

Chitra, P. .

KSCE JOURNAL OF CIVIL ENGINEERING, 2009, 13 (05) :347-358

← 1 2 3 4 5 →