Exploring Carbon Nanotubes for VLSI Interconnects

被引：0
作者：
Santos, Joshua A. [1 ]
Kelly, Troy F., Jr. [1 ]
Ullah, Muhammad S. [1 ]
机构：
[1] Florida Polytech Univ, Dept Elect & Comp Engn, Lakeland, FL 33805 USA
来源：
2019 IEEE 62ND INTERNATIONAL MIDWEST SYMPOSIUM ON CIRCUITS AND SYSTEMS (MWSCAS) | 2019年
关键词：
Multi-wall Carbon Nanotube; Propagation Delay; VLSI Interconnect; MODEL;
D O I：
10.1109/mwscas.2019.8885390
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
As a result of a decrease in cross-section, increases have been noted in several thermal and electrical properties of copper interconnects. To mitigate such concerns, new approaches are being considered for new wiring solutions for VLSI technologies. The incorporation of carbon nanotubes (CNTs) in VLSI design to replace existing interconnection material, may be an efficient and cost-effective evolution from current materials. Carbon nanotubes, more specifically multi-walled carbon nanotubes (MWCNT), have been identified as potential alternatives to diminish such concerns. This paper will delineate the shared and differing aspects of each of the CNT structures.
引用
收藏
页码：1122 / 1126
页数：5
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