The Numerical Simulation of Rapidly Solidified Cu-Cr Alloys

被引：3
|
作者：
Zhou, Z. M. [1 ]
Xiao, Z. P. [1 ]
Wei, B. W. [1 ]
Hu, Y. [1 ]
Tang, L. W. [1 ]
Liu, C. [1 ]
机构：
[1] Chongqing Univ Technol, Sch Mat Sci & Engn, Chongqing 400054, Peoples R China
来源：
2012 INTERNATIONAL WORKSHOP ON INFORMATION AND ELECTRONICS ENGINEERING | 2012年 / 29卷
关键词：
Cu-Cr alloys; cooling rate; rapid solidification; simulation; MICROSTRUCTURE;
D O I：
10.1016/j.proeng.2012.01.599
中图分类号：
TH [机械、仪表工业];
学科分类号：
0802 ;
摘要：
The simulation of rapidly solidified Cu-Cr alloys was studied in this paper. The rapidly solidified Cu-Cr alloys can be approximately modeled by one-dimensional heat conduction equation. The temperature distribution and the cooling rate of rapidly solidified Cu-Cr alloys are determined by integration of the equation. The cooling rate is inverse proportion to the square of the thickness of the alloys. The thermal diffusivity of the Cu-Cr melt and the coefficient of thermal storage of the cooling copper mediator are the most important factors that decide teh cooling rate of the alloys. The simulative results are coincident very well with the experimental results for the microstructure of rapid solidified Cu-Cr alloys prepared by melt-spinning. (C) 2011 Published by Elsevier Ltd. Selection and/or peer-review under responsibility of Harbin University of Science and Technology
引用
收藏
页码：3944 / 3948
页数：5
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